Electrical Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Efficient Data Center: Using data center instrumentation and server refresh to optimize compute performance in constrained environments
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This white paper examines the current state of data center power and cooling. Explore the advantages of a hardware refresh and determine if an upgrade is right for your organization.
Posted: 29 Aug 2012 | Published: 01 Jul 2011

Dell, Inc. and Intel®

Real-time Compression Results In Storage Efficiency
sponsored by IBM
WHITE PAPER: Access this white paper to learn about a storage system that uses real-time compression and SSD technology to boost storage performance. Read on to learn more about how the benefits of this storage system provide a strong ROI, and how your organization could cut costs.
Posted: 01 Apr 2015 | Published: 30 Apr 2014

IBM

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell

Enterprise Solution Design for SAP HANA
sponsored by HP & Intel®
WHITE PAPER: In this resource, explore the three principles of great enterprise design—stability, scalability, and agility—and learn how to apply them to your SAP landscape with a focus on SAP HANA. Read on for best practices and key design considerations for implementing your SAP HANA enterprise-level solution.
Posted: 25 Sep 2013 | Published: 28 Feb 2013

HP & Intel®

Solihull Council Marks a Decade with Red Hat Open Source Technology , Saving over £1 Million
sponsored by Red Hat - HPE
WHITE PAPER: In this informative paper, learn why a government industry has relied on the same Linux solution for the past ten years, using an open source model to simplify software and hardware implementations, reduce costs, and more.
Posted: 10 Apr 2013 | Published: 10 Apr 2013

Red Hat - HPE